JPS6481392A - Injection molding of printed circuit board - Google Patents
Injection molding of printed circuit boardInfo
- Publication number
- JPS6481392A JPS6481392A JP23919887A JP23919887A JPS6481392A JP S6481392 A JPS6481392 A JP S6481392A JP 23919887 A JP23919887 A JP 23919887A JP 23919887 A JP23919887 A JP 23919887A JP S6481392 A JPS6481392 A JP S6481392A
- Authority
- JP
- Japan
- Prior art keywords
- film
- board
- cavity
- circuit
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001746 injection moulding Methods 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23919887A JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23919887A JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6481392A true JPS6481392A (en) | 1989-03-27 |
| JPH0563111B2 JPH0563111B2 (en]) | 1993-09-09 |
Family
ID=17041185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23919887A Granted JPS6481392A (en) | 1987-09-24 | 1987-09-24 | Injection molding of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6481392A (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206989A (ja) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | プリント配線体 |
| GB2340666A (en) * | 1998-08-17 | 2000-02-23 | Ford Motor Co | Method of laminating a flexible circuit to a substrate. |
-
1987
- 1987-09-24 JP JP23919887A patent/JPS6481392A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206989A (ja) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | プリント配線体 |
| GB2340666A (en) * | 1998-08-17 | 2000-02-23 | Ford Motor Co | Method of laminating a flexible circuit to a substrate. |
| US6197145B1 (en) | 1998-08-17 | 2001-03-06 | Ford Motor Company | Method of laminating a flexible circuit to a substrate |
| GB2340666B (en) * | 1998-08-17 | 2003-10-29 | Ford Motor Co | Method of laminating a flexible circuit to substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563111B2 (en]) | 1993-09-09 |
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